F1-EE "M" version - Toplight modules for F1 series containers

[k|ngp|n]

Originally Posted by Oj0

It has no way of interfacing with the CPU so I'm not quite seeing how this will change anything, hints please

What TiN is showing here is not really what I am referring too, though this is pretty neat for F1 pots.

Lets give it some time to develop and then you will know what I mean by game changing

[knopflerbruce]

Some weird kind of anti-CB/CBB device?

[Oj0]

OFFHAND it doesn't look as if there's any interfacing of any kind so it appears to be a standalone device.

[knopflerbruce]

Allright, maybe this device can override the OCP on the new i5/i7 chips?

[Oj0]

I still want to know why my question about in or under was ignored

[Sam__]

But it does seem to the the right dimensions to fit between the pot and the cpu. :S

theres at least one 8-pin ic on it. Looks like there could be a few connections for external control.

this is very confusing.

[Oj0]

It's so hella confusing I'm calling Hella

It's going to:
Worsen contact, poorer thermal transfer
Get crushed to death

if it goes between pot and chip. However, the dimensions seem to be the same as inside a pot as well.

[knopflerbruce]

Originally Posted by Oj0

I still want to know why my question about in or under was ignored

...because the placement is under the board, so it CAN interface with the CPU That's why the hole is there for, I bet... so it won't interfere with the stuff right under the chip.

[Oj0]

That hole is too small, the entire thing is 45mm across so the hole is about 9mm

[Sam__]

So it might go inside the pot, but what could it do there? warm it up quickly? but people have already had the nono on it being a cb/cbb device.