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Old 11-23-2013, 07:56 PM
TM3K- TM3K- is offline
Join Date: Oct 2011
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Default Few questions about technical aspects of extreme conditions

Hi All.
On my university i'm working on presentation about voltage regulator modules used in desktop computer components. I would also attach a part about overclocking or rather how components works in cold conditions. I wonder how many of us, (persons which use ln2 at least from several years) realy knows something about cold bug/cold boot bug issue, cast an engineer eye. I already have this title, so answers like "because is to cold", "i suppose that is something wrong with.." etc. will be not enough.

Can somebody tell me something technical about:

1. Why Intel have cb, but amd not
2. Is cbb strongly connect with pll voltage or internal oscillator? (when motherboard turns off instantly) ?
3. why better vrm (at least in older platforms like 775) give an extra limit to cbb
4. why higher vcc(v-core, v-gpu) operate on cb limit

Last edited by TM3K-; 11-23-2013 at 08:05 PM.
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Old 11-23-2013, 11:08 PM
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TiN TiN is offline
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1. Not exactly true. There were Intel CPUs w/o cold issues on LN2 temps, and there were AMD CPUs with issues on -30c
2. From common basis. Cold issues are related to units in CPU or motherboard which are too much affected by thermal drift. This is usually clocks, high-speed links (DMI,PCIe,DDR,QPI,HT etc), sometimes cache, etc. When temperature change - parameters of conductors and elements are changing too. Try measure 10kohm usual resistor by DMM and then submerge it into LN2. You will see that resistance is no more stay at 10Kohm.
3. Usually higher power VRM with cleaner power just helps to keep silicon running more stable, crash later.
4. Because temperature is higher as well inside chip, don't forget thermal resistance and delays. Even if you have in both cases -100c on LN2 pot surface, temperature inside chip will be let's say -90c with 1.4V, and -80c with 1.5V. Same reason why often higher voltage make things worse.

There are lot of knowledge involved in operating electronics on subzero temperatures, and exact answers to your questions (which are way tooo common, often behaviour of one CPU model with die A is very different to another die B even same socket,VRM,etc (SandyBridge(-E) -> IvyBridge(-E), AMD Winchester to Venice, Netburst to Conroe )
are not even known well by those who design these products, because usually there
are just no testing done at those temp as outside of spec.
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